EINECS Number: 239-572-3
Melting Point: 85-7°
Molecular Weight: 350.57
HMIS Key: 3-2-1-X
Formula: C6H15AuClP
Application: Forms methanium salts on reaction with tetrakis(dimethoxyboryl)methane.1
Reference: 1. Schmidbauer, H. et al. Chem. Ber. 1992, 125, 2705.
Additional Properties: Soluble: methylene chloride
Intermediate for anti-arthritic drug
Gelest有机硅产品系列中介绍了常规有机硅油以及热,氟硅酮,亲水和低温等级的设计和工程特性。Gelest有机硅产品线还介绍了可配制为机械,光学,电子和陶瓷应用的涂料,薄膜,固化橡胶和胶粘剂的反应性有机硅。