Molecular Weight: 1,000-3,000
Flashpoint: 103°C (217°F)
HMIS Key: 1-1-0-X
TSCA: TSCA
Application: Employed in CVD of silicon carbonitride films.1
Forms polycarbosilanes at elevated temperature.2
Reference: 1. Scarlete, M. et al. US Patent 7,396,563, 2008. (label licensed Gelest Product)
2. Yajima, S. et al. J. Mater. Sci. 1978, 13, 2569.
Additional Properties: UV max: 314 nm
Solid state source for volatile siliconcarbonitride (SiCN) precursors utilized in passivation of silicon-based photovoltaics
Gelest有机硅产品系列中介绍了常规有机硅油以及热,氟硅酮,亲水和低温等级的设计和工程特性。Gelest有机硅产品线还介绍了可配制为机械,光学,电子和陶瓷应用的涂料,薄膜,固化橡胶和胶粘剂的反应性有机硅。