BoilingPoint:6.7°
EINECSNumber:213-603-0
MeltingPoint:-135.9°
MolecularWeight:74.20
AlternativeName:3MS
SpecificGravity:0.638
HMISKey:2-4-1-X
Formula:C3H10Si
TSCA:TSCA
Application:Employedinplasmatreatmentofsurfaces.1
Treatmentoftitaniumalloysandstainlesssteelsurfacesinhibitsbiofilmformation.2
Reference:1.Hendricks,N.etal.SemiconductorInt'l.2000,23,95.
2.Ma,Y.etal.Antimicrob.AgentsChemother.2012,56,5923.
Fieser:F&F:Vol.1,p1235;Vol.2,p441;Vol.13,p101;Vol.16,p292.
AdditionalProperties:320
Dipolemoment:0.52debye?Hcomb:-766kcal/mole
Criticaltemperature:158.85°C?Hform:-39kcal/mole
Criticalpressure:31.48atm?Hvap:5.8kcal/mole
Formstrimethylsilylalkanesfromolefinsw/PtcatalystVaporpressure
Gelest有机硅产品系列中介绍了常规有机硅油以及热,氟硅酮,亲水和低温等级的设计和工程特性。Gelest有机硅产品线还介绍了可配制为机械,光学,电子和陶瓷应用的涂料,薄膜,固化橡胶和胶粘剂的反应性有机硅。