BoilingPoint:-14.5°
EINECSNumber:216-466-5
MeltingPoint:-132°
MolecularWeight:62.22
SpecificGravity:0.686
HMISKey:4-4-2-X
Formula:H6Si2
Purity:100%
Application:Employedinepitaxialdepositionofsiliconforsolarandphotoelectricdevices.1
Reference:1.Lin,H.etal.SolidStateElectron.1996,39,1731.
AdditionalProperties:Criticaltemperature:158.85°C
Criticalpressure:50.63atm
Gelest有机硅产品系列中介绍了常规有机硅油以及热,氟硅酮,亲水和低温等级的设计和工程特性。Gelest有机硅产品线还介绍了可配制为机械,光学,电子和陶瓷应用的涂料,薄膜,固化橡胶和胶粘剂的反应性有机硅。