BoilingPoint:270°
EINECSNumber:233-513-5
MeltingPoint:108°
MolecularWeight:207.22
SpecificGravity:1.168
HMISKey:4-1-1-X
Formula:C10H14BeO4
Application:Forms?-diketonatepolymersbysubstitutionreactions.1
Reference:1.Wilkins,J.U.S.Patent2,659,711,1953.
AdditionalProperties:Metalcontent:4.2-4.4%Be
?Hsub:8.51kcal/moleSoluble:ethanol,ether,toluene
Sublimes:80°/0.1mmIntermediateforhighthermalconductivityceramiccoatings
Gelest有机硅产品系列中介绍了常规有机硅油以及热,氟硅酮,亲水和低温等级的设计和工程特性。Gelest有机硅产品线还介绍了可配制为机械,光学,电子和陶瓷应用的涂料,薄膜,固化橡胶和胶粘剂的反应性有机硅。