BoilingPoint:86-7°/5
EINECSNumber:213-620-3
MeltingPoint:-73°
MolecularWeight:244.95
SpecificGravity:0.954
HMISKey:2-2-0-X
Formula:C12H28Ge
RefractiveIndex:1.4510
TSCA:TSCA
Application:Catalystforstyrenepolymerization.1
Reference:1.Anand,L.etal.Ind.J.Chem.1967,5(5),188.
AdditionalProperties:Dielectricconstant,25?C:1.92
Surfacetension,25?:25dynes/cm?Hcomb:-2
?Hform:-69.6kcal/moleVaporpressure
Gelest有机硅产品系列中介绍了常规有机硅油以及热,氟硅酮,亲水和低温等级的设计和工程特性。Gelest有机硅产品线还介绍了可配制为机械,光学,电子和陶瓷应用的涂料,薄膜,固化橡胶和胶粘剂的反应性有机硅。