BoilingPoint:163-4°
EINECSNumber:209-905-7
MeltingPoint:-93°
MolecularWeight:188.84
SpecificGravity:0.991
HMISKey:2-3-0-X
Formula:C8H20Ge
RefractiveIndex:1.4428
TSCA:TSCA
Application:EmployedinsynthesisofGenanowiresforsensorapplications.1
Reference:1.Hanrath,T.etal.Adv.Mater.2003,15(5),437.
AdditionalProperties:Dielectricconstant,25?C:1.97
Surfacetension,25?:24dynes/cm?Hform:-45.3kcal/mole
?Hvap:9kcal/moleDecomposes>350°
Vaporpressure
Gelest有机硅产品系列中介绍了常规有机硅油以及热,氟硅酮,亲水和低温等级的设计和工程特性。Gelest有机硅产品线还介绍了可配制为机械,光学,电子和陶瓷应用的涂料,薄膜,固化橡胶和胶粘剂的反应性有机硅。